advanced packaging 結果共10筆

TSMC partners with Amkor Technology to boost AI capacity in Arizona. The collaboration will enhance semiconductor packaging and testing services, benefiting TSMC’s Phoenix plant clients.

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Discover how Taiwan is addressing the global AI supply crisis and advancing AI technology, as highlighted at the COMPUTEX event in Taipei, featuring industry leaders and innovative solutions.

Goldman Sachs predicts that Taiwan Semiconductor Manufacturing Company (TSMC) will double its CoWoS production capacity by 2025, leading to a raised target price of NT$975. The forecast includes plans for advanced CoWoS packaging plants in Chiayi and potential expansion to Japan. Customer demand for advanced packaging, especially CoWoS, is expected to rise with the adoption of 2-nanometer process technology. Goldman Sachs also revised TSMC’s capital expenditure forecast and profit outlook for major AI companies, reflecting a positive growth trend in the industry.

Vice Premier Cheng Wen-tsan announces TSMC’s plan to build two cutting-edge chip packaging CoWoS facilities in Chiayi Science Park, with construction set to begin in May 2024. The project is expected to create around 3,000 job opportunities and boost the local economy.

Taiwan Semiconductor Manufacturing Co. (TSMC) has emphasized that Taiwan is its primary base and is considering various locations for potential semiconductor factories. TSMC has expressed interest in collaborating with the Southern Taiwan Science Park for potential spots. Media reports suggested that TSMC planned to build a one-nanometer factory in the Science Park in Taibao City, Chiayi County. These reports cited anonymous sources and stated that TSMC proposed the need for a 100-hectare plot, with 40 hectares dedicated to an advanced packaging factory and 60 hectares for the proposed one-nanometer factory. TSMC has also disclosed its evaluation for expanding the two-nanometer production infrastructure and planning to establish three factories in Kaohsiung to meet the growing demand for their two-nanometer process.

Marketech International Corp., a semiconductor giant, is set to achieve new operational heights through factory expansion and the promotion of new business ventures, including 2-nanometer projects and advanced packaging. With high-profile orders exceeding NT＄60 billion, the company anticipates robust financial health and ambitious expansion plans. In December 2023, Marketech achieved a record monthly growth rate of 12.7% and an annual surge of 13.8%, with consolidated revenue reaching NT＄5.63 billion. Furthermore, the company’s accumulated annual consolidated revenue in 2023 reached NT＄56.28 billion, marking a growth of 11.7%. These impressive results position Marketech as an emerging player in the global semiconductor market, poised for future growth and expansion through advanced technological strategies.

Taiwan Semiconductor Manufacturing Company (TSMC) predicts a surge in artificial intelligence (AI) orders in the coming year, with October’s revenue reaching NT$243.203 billion ($8.6 billion), a 34.8 percent monthly increase and a 15.7 percent annual increase. TSMC’s stock price has also been on a steady rise, accumulating a growth of 7.5 percent since November. Morgan Stanley semiconductor research analyst Charlie Chan attributes TSMC’s revenue growth to signs of recovery and the robust demand for AI semiconductors worldwide. NVIDIA’s expanded order to TSMC, along with increased demand from clients like Apple and Advanced Micro Devices (AMD), has led TSMC to accelerate the enhancement of its advanced packaging technology, Chip on Wafer on Substrate (CoWoS). CoWoS enables TSMC to effectively reduce costs and trim electric consumption by packaging chiplets on a silicon interposer and placing them on a package substrate. However, TSMC’s current CoWoS capacity remains a bottleneck for NVIDIA’s AI GPU chips, though the company forecasts a rebound in productivity by the end of 2024 to meet customer demand.

Taiwan Semiconductor Manufacturing Co. (TSMC) announced its financial results for the third quarter of 2023, revealing a capital expenditure projection of NT＄226.6 billion for the year. The company plans to allocate 70% of this capital outlay to advanced processes, 20% to specialized processes, and 10% to packaging and other related sectors. TSMC’s consolidated revenue for the third quarter decreased by 10.8% compared to the same period last year, reaching approximately NT＄546.73 billion. The earnings per share (EPS) stood at NT＄8.14.