advanced packaging 結果共54筆

The restaurant was the Brick Kiln, a good but unflashy Taipei spot far from any conference hall. The host stood on a stool to be seen. The guest list ran to more than thirty CEOs, between them representing close to a trillion US dollars in market capitalization and almost every link in the global AI hardware supply chain. Jensen Huang toasted, thanked, moved from table to table, told an affectionate joke about a portrait he said looked more like TSMC’s C.C. Wei than himself, and at the end of the evening walked out into the street to hand sweets to the families and children who had gathered hoping for a glimpse. ＂Chemistry＂ was the word the Nvidia blog post used to describe the event. The casualness was the point.

Nvidia CEO and Founder Jensen Huang has laid the table for Computex 2026 next week with all the main courses already plated, following Nvidia’s blockbuster quarterly numbers and his definition of the next wave of growth, ACIE.

Taiwan’s chip packagers and testers, the companies that take a freshly made semiconductor and turn it into a usable, qualified module, are in the middle of the biggest expansion their industry has ever seen.

TSMC used its 2026 Technology Symposium in Hsinchu on May 14 to tell two stories. The first was about steel and concrete. The second was about light.

TSMC’s April revenue of NT$410.7 billion (US$12.6 billion) was up 17.5 percent year on year and down 1.1 percent from March, the company’s highest April on record and second-highest monthly result ever. Cumulative revenue for the first four months reached NT$1.545 trillion (US$47.4 billion), up 29.9 percent from the same period in 2025.

The April 2026 monthly revenue reports filed on the Taiwan Stock Exchange confirmed what the first quarter had already strongly implied: the AI infrastructure cycle is no longer a story about TSMC and a handful of server assemblers. It is now spread across the full hardware stack, from copper-clad laminates and ABF substrates to liquid-cooling modules, server rails and memory.

For most of the last twenty years, the MediaTek story has been about smartphones. The company built itself into the world’s largest mobile chip designer by volume on the back of mid-tier Android handsets sold across Asia, Latin America, and Europe. At Computex 2026, the next chapter of the company’s history will begin to unfold.

Computex 2026 opens on June 2 in Taipei under the banner “AI Together,” and for Taiwan’s server makers the timing is close to perfect. The first quarter delivered record results across the entire group. Hyperscaler orders for Nvidia’s next-generation GB300 rack systems are accelerating into the second half of the year. And a new category of compute that the industry has started calling Physical AI, is opening a fresh growth lane alongside the familiar workloads of training and inference.

Once Taiwan’s historic seat of government, the city of Tainan has undergone a dramatic transformation from a sleepy backwater of narrow old streets and vibrant temples into a thriving technology hub anchored by the Southern Taiwan Science Park (STSP). A record-shattering 2025, new advanced-process fab announcements, and a fast-tracked expansion at Shalun have cemented Tainan’s place at the heart of the global semiconductor supply chain.

At its 2026 North America Technology Symposium, TSMC unveiled a roadmap that highlights where the world’s largest contract chipmaker is placing its boldest bets and where it is choosing restraint.

Powertech Technology (6239.TW) has spent nearly three decades as the world’s largest memory packaging and testing company. Now, as advanced packaging becomes the tightest bottleneck in the AI supply chain, Powertech is positioning itself as the credible alternative to TSMC’s CoWoS platform. With a proprietary glass-substrate technology that rivals TSMC at significantly lower cost, Powertech has gone from quiet memory specialist to one of the most strategically important companies in the AI chip ecosystem.

Global semiconductor manufacturing equipment sales reached a record US$135.1 billion in 2025, up 15% from US$117.1 billion in 2024, according to the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report published by SEMI on April 13, 2026. The growth was driven by sustained expansion in advanced logic and memory capacity, underpinned by accelerating AI-related demand.

ASE Technology Holding (2311.TW) is the world’s largest outsourced semiconductor assembly and test company, commanding more than 30% of the global market. For four decades the Kaohsiung-based firm has performed the essential final steps of chipmaking: turning raw silicon wafers into functional, tested chips ready for deployment. As advanced packaging becomes the tightest bottleneck in the AI supply chain, ASE has moved from behind-the-scenes enabler to one of the most strategically important companies in global technology.

For decades, making chips faster meant shrinking transistors. That approach is hitting physical and economic limits. The semiconductor industry has found a powerful alternative: instead of building one giant chip, engineers now place several smaller chips side by side or stack them vertically inside a single package, connecting them with ultra-fast internal wiring. This is advanced packaging, and it has become the most critical bottleneck in the global AI supply chain.

For years, Taiwan’s outsourced semiconductor assembly and test (OSAT) firms have operated quietly behind TSMC’s headlines. That era is over. As the AI buildout accelerates, advanced packaging has become the tightest chokepoint in the entire semiconductor supply chain, and Taiwan’s packaging and test companies have moved from back-office enablers to strategic kingmakers. The Q2 2026 outlook is defined by three realities: demand is outrunning capacity, the technology roadmap is moving faster than ever, and every major player is investing at record levels to keep up.

Taiwan’s technology sector first-quarter 2026 results send a clear message that the AI infrastructure boom is continuing to accelerate. Across every layer of the island’s tech ecosystem, companies are posting record numbers and committing unprecedented capital to expand capacity. The real story emerging from Q1 is not any single headline figure, but how much more central Taiwan has become to the world’s computing infratructure.

Computex has long served as a barometer for the global technology industry. This year’s edition, running June 2–5 in Taipei under the banner “AI Together,” carries added weight. The first quarter of 2026 delivered a cascade of transformative developments: a landmark US-Taiwan trade agreement, hundreds of billions of dollars in new capital commitments, an intensifying supply crunch at the most advanced chip nodes, and the rise of Physical AI as the industry’s next organizing principle. Together, these shifts are realigning Taiwan’s technology economy. Computex is where these threads will converge in public.

The 2026 Taiwan Lantern Festival in Chiayi County dazzles with over 1 million attendees. Highlights include a Super Mario collaboration, drone shows, and cultural exhibits.

National Taiwan University of Science and Technology and GPTC signed a NT$50 million deal to boost semiconductor research and talent development. The partnership focuses on equipment integration, material innovation, and offers scholarships and job opportunities for students.

Every AI accelerator that powers today’s largest models relies on an advanced substrate to connect the chip to the outside world. These ABF substrates, the high-performance interconnect layers that bridge GPU dies and circuit boards inside advanced packages, can only be manufactured at the required specifications by Japan’s Ibiden and Taiwan’s Unimicron Technology. 

Before the high-bandwidth memory in today’s AI accelerators can function, each chip must be precisely packaged, bonded, and tested to meet exacting specifications. Powertech Technology (PTI), Taiwan’s second-largest outsourced semiconductor assembly and test (OSAT) provider, handles this critical work for many of the world’s leading memory and AI chip makers. As AI infrastructure spending accelerates beyond US$650 billion in annual hyperscaler capital expenditure, Powertech has emerged as both a linchpin of the memory supply chain and a serious contender in advanced AI chip packaging.

The AI infrastructure story has mostly been told through the lens of advanced chips and the foundries that produce them. But there is another layer of the supply chain, often overlooked, that determines whether any of these systems actually work. Signals must be transmitted. Power must be delivered across increasingly complex architectures. And the companies solving these high-density interconnect challenges are increasingly headquartered in Taiwan.

The artificial intelligence revolution runs on silicon, but not just any silicon. The processors driving today’s most advanced AI systems demand a level of integration and performance that pushes semiconductor engineering to its limits. At the center of this challenge sits CoWoS (Chip-on-Wafer-on-Substrate), an advanced packaging technology developed by TSMC that has quietly become the essential foundation of AI infrastructure worldwide.

The Taiwan Printed Circuit Association will showcase a high-end packaging zone at APEX EXPO 2026 in Anaheim, Calif., March 17-19, to boost Taiwanese businesses amid global supply chain changes.

For decades, the companies that package and test the world’s semiconductors have been the unsung heroes of the chip industry. While designers like Nvidia grabbed headlines and foundries like TSMC earned Wall Street’s admiration, outsourced semiconductor assembly and test (OSAT) firms quietly handled the essential final steps of turning raw silicon into functional chips. That era of invisibility is ending fast. Fueled by the artificial intelligence revolution, Taiwan’s OSAT industry is stepping into the spotlight. The island controls 48% of the global OSAT market, employs over 130,000 skilled workers, and is home to five of the world’s top ten OSAT companies. What was once considered a commodity business has become an indispensable link in the AI supply chain.